(module USON6 (layer F.Cu) (tedit 5E4DAB76)
  (fp_text reference REF** (at 0.11 3.68) (layer F.SilkS))
  (fp_text value USON6 (at -0.16 -3.7) (layer F.Fab))
  (pad 1 smd roundrect (at -0.95 -0.675) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 2 smd roundrect (at -0.95 0) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 3 smd roundrect (at -0.95 0.65) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 4 smd roundrect (at 0.95 0.65) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 5 smd roundrect (at 0.95 0) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 6 smd roundrect (at 0.95 -0.65) (size 0.5 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.5)
    (solder_mask_margin 0.07))
  (pad 7 smd rect (at 0 0) (size 0.65 1.35) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.02))
  (pad 7 thru_hole circle (at 0 -0.4) (size 0.2 0.2) (drill 0.2) (layers *.Cu *.Mask)
    (solder_mask_margin 0.02))
  (pad 7 thru_hole circle (at 0 0.4) (size 0.2 0.2) (drill 0.2) (layers *.Cu *.Mask)
    (solder_mask_margin 0.02))
)
